Wafer Grinding Machines

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Wafer Grinder: Finishing & Grinding Machines | Koyo ...

Description: Special grinder for hard but brittle wafers. High-precision grinder to replace lapping machines. Fully automated cassette to cassette operation. Grinding parameters of each wafer can be stored. Grinders Centerless Grinders Surface Grinders Special Purpose Grinders.

Wafer Backside Grinding - Okamoto Machine Tool Works,Ltd

GDM300. CONCEPT. For thin wafer, Grinding/Polishing/Detape fully automatic process by 1 machine. Feature. ・The process from back grinding to wafer mounting continuously by fully automatic system, which enable to grind till 25um thickness. ・With 2 head polishing stage, throughput is almost double compared with 1 polish head system.

Wafer Edge Grinding Machine: W-GM-5200|Wafer …

Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possible. Low damage grinding method is available. Machine specification ready for 300 mm wafer.

Edge Grinder for wafer edge solution. Improves quality ...

Wafer Edge Grinding Machine W-GM-4100 Series It’s a compact and cost effective 1-stage machine with features that we have accumulated with mass production machines of W-GM series. Options for grinding various types of wafer shape and other customized features are available.

Wafer Grinder - GRINDTEC 2022 | IMTS Exhibition

Wafer backgrinding, also known as wafer thinning, is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits (IC). Conventional grinding is an aggressive mechanical process that utilizes a diamond and resin bonded grind wheel mounted on a high speed spindle to perform the material removal. The grind ...

Edge Grinder for wafer edge solution. Improves quality ...

Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with ...

Wafer Grinding Machine Manufacturer - Joen Lih …

Rotary table series wafer grinding machine is manufactured by Joen Lih Machinery Co., Ltd.. We provide precision wafer grinder series that are available for customers to select for different demands. Please contact us for further information.

Wafer Edge Grinding Machine - GRINDTEC 2022 | IMTS …

The Specialized Wafer Edge Grinding Machine. Semiconductor wafer grinders Many companies have developed several types of grinding machines used in the semiconductor industry for the production of silicon wafers and the production of integrated circuits. The vertical and horizontal spindle systems are used in conjunction with specially designed diamond grinding wheels that only cut at the edge ...

Back Grinding Machines In Semiconductor

Back thinning grinding and fine grinding of apphire epitaxial wafer silicon wafer gallium arsenide and GaN wafer Applicable Grinding Machine The back grinding wheels can be used for the Japanese German American Korean and other grinders Such as Okamoto Disco Strasbaugh and others grinding machine Advantages efficiency. Get Price Lapping platespolishing plates for all applications. Lapping ...

Polishing & Grinding Manufacturers - Wafer Production ...

Polishing & Grinding Manufacturers - Wafer Production Equipment. Companies involved in Polishing & Grinding machine production, a key piece of equipment for the production of solar wafers. 26 Polishing & Grinding equipment manufacturers are listed below.

Grinding Machines - Products | Komatsu NTC Ltd.

Indeed, Komatsu NTC grinding machines used to be a subject of adoration in both the domestic and overseas markets. The mythology in these words has further evolved. Cylindrical grinding machines NTG Series . Well-developed lineup from large machines to compact machines. High speed, high accuracy, and space saving. High reliability has achieved high productivity. Camshaft grinding machines …

Machines | 株式会社岡本工作機械製作所 機械から探す

Grinding machine, Semiconductor equipment, Gear and Casting only One for Total Abrasive Machine manufacturer in the World ... Wafer Back Grinding Machine Series. In-line grinder for less than 25um thickness GDM300. 200mm back grinder GNX200B. 300mm back grinder GNX300B. 300mm Ultra thin wafer polisher GNX12PB . Ultra accurate back grinder SVG202MKⅡ. Grinder for brittle material …

Special purpose grinding machines - Grinding Machines ...

Exclusive grinding machine for aircraft landing gear ASG specifications. Specification items ASG-300/400 ASG-400/450; Swing over table [mm] On table ⌀1,200 Gap area ⌀3,000: On table ⌀1,200 Gap area ⌀4,000: Distance between centers [mm] 4,000: 4,500: Grinding wheels [mm] ⌀610 ⌀610: Max. wheel peripheral velocity [m/s] 36.7: 36.7: Max. wheel head rapid traverse [m/min] Traverse 7 ...

Fine grinding of silicon wafers - K-State

Wafer shape controlling in wafer surface grinding. Z.J. Pei, A. Strasbaugh / International Journal of Machine Tools & Manufacture 41 (2001) 659–672 663 coolant will be …

Wafer Grinder ∕ Polisher series - N-TEC Corp.

N-TEC Corp. is a famous Taiwanese R & D and manufacturer dedicated in the innovative development of LED equipment. N-TEC Corp. has an extended line of wafer breakers including 6” and 8”. The unique tape Grinder, Lapping, Polishing machine, FULL-auto laminating, mounting, expanding and retaping machine were developed.

US5679060A - Wafer grinding machine - Google Patents

The wafer grinding machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station.

KOYO MACHINE INDUSTRIES CO.,LTD.

Both sides are simultaneously ground for each wafer and allows to store and traceability of grinding data for each wafer. Cassette transfer can be handled by OHT.Double Disc Wafer Grinder that can be replcaced from the lapping machine. Product Specifications Download

Wafer grinding machine - China Customs HS Code & …

Latest China HS Code & tariff for Wafer grinding machine - Tariff & duty, regulations & restrictions, landed cost calculator, customs data for Wafer grinding machine …

Wafer Grinder Market - Competitive Insight, Trends ...

The precision machines business division of the company is critical to the wafer grinding market as it provides grinding tools for semiconductor manufacturing. GF01 series, IF series, poligrind, and ultra polygrind are the products specified for wafer grinding application. The company as of March 31, 2019, recorded 3,619 employees and revenue of JPY 147.5 billion.

Grinder|Micro Engineering, Inc.

It is the fully automatic composite machine of grinding and polishing which performs the chuck surface cleaning, rough grinding, final grinding and polishing in one machine. Use. It archives fully automated machine of grinding, polishing, dicing frame supply, tape mount and demount process. Feature. It enables to grind 8" / 12" wafer's thickness into 30um; It is integrated machine including a ...

R Series: Surface Grinder | Koyo Machinery USA

Wafer Grinder/Lapping Machine; Quote Request; Request Product Catalog; Demonstration Machines; Precision Apparatuses. Ball Screws; Spindles; Factory Automation ; Support. Parts; Service; Spindle Rebuild; Machine Rebuild; Contact; R Series Surface Grinder R031. Application Example(s): Cage, Spacer. Industry: Automotive. Grinding Capacity: Grinding capacity up to Ø100mm. Description: …

Machines | 株式会社岡本工作機械製作所 機械から探す

Grinding machine, Semiconductor equipment, Gear and Casting only One for Total Abrasive Machine manufacturer in the World ... Wafer Back Grinding Machine Series. In-line grinder for less than 25um thickness GDM300. 200mm back grinder GNX200B. 300mm back grinder GNX300B. 300mm Ultra thin wafer polisher GNX12PB . Ultra accurate back grinder SVG202MKⅡ. Grinder for brittle material …

Wafer Backgrind - www.EESemi.com

Wafer Backgrind is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as 'wafer thinning.' Wafer backgrinding has not always been necessary, but the drive to make packages thinner and thinner has made it indispensable. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 ...

DISCO precision machines - dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.